The main purpose
For H&X garnet abrasive inch monocrystalline silicon, polycrystalline silicon, gallium arsenide, wire-cut quartz crystal. Processing materials are engineered solar photovoltaic industry, the semiconductor industry, piezoelectric crystal industry.
The main analysis of silicon carbide detection methods:
Determine the content of silicon carbide in the silicon carbide hardness. SiC particle size on the line cutting a great impact, but the most important thing is the shape of the silicon carbide particles. Because when H&X Aluminium hydroxide wire cutting silicon carbide particles to change the shape of the free state of cutting efficiency and cutting quality to be an important influence.
Detection methods: silicon content requires atomic absorption detection (high detection efficiency, more accurate values).
Silicon carbide particle resistance method requires particle analyzer (high efficiency).
Silicon carbide grain type detection requires Reith RA200 particle analyzer. (Particle shape can be analyzed more accurate roundness factor)
Black silicon carbide is quartz sand, petroleum coke and quality silica as the main raw material in electric arc furnace smelting. Its hardness between corundum and diamond, the mechanical strength is higher than corundum, brittle and sharp. Black silicon carbide SiC containing approximately 98.5% higher than its toughness green silicon carbide, mostly for processing low tensile strength of the material, such as glass, ceramics, stone, refractory materials, cast iron and non-ferrous metals.
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